Application: Designed for precise cutting and scribing of solar semiconductor silicon wafers, ceramic wafers, and other delicate materials, ensuring high accuracy and minimal damage to the surfaces, making it ideal for various advanced manufacturing processes in the semiconductor and solar industries
Features: 1. Laser scribing machine is a kind of equipment integrating light, machine and electricity; 2. 1064nm fiber laser is used as the laser source; 3. The fiber laser has a very high degree of integration, the optical path is fully enclosed, and no consumables, maintenance-free, long life, good optical quality (㎡ <1.3) and high reliability; 4. Small size, fast processing speed and low power consumption; 5. Novel appearance, reasonable structure, easy to operate, high precision and stable performance.
Specifications: Specifications Description Service Life ≥ 100,000 hours Energy Consumption ≤ 1000W Electro-Optical Conversion Efficiency ≥ 35% Laser Output Mode Fundamental mode Power Stability ≤ 3% Warranty Period ≥ 1 year Equipment Size 1300mm * 760mm * 1350mm Equipment Weight 600kg
For more details please contact us as below: Wuhan YOHA Solar Technology Co., Ltd Address: No.776 High Tech Avenue, East Lake New High-tech Development Zone, Wuhan City, Hubei, China Tel: 0086-13959254228 Website:www.yohasolar.com Email:johnyang@yohasolar.com