Application:
Designed for precise cutting and scribing of solar semiconductor silicon wafers, ceramic wafers, and other delicate materials, ensuring high accuracy and minimal damage to the surfaces, making it ideal for various advanced manufacturing processes in the semiconductor and solar industries

Features:
1. Laser scribing machine is a kind of equipment integrating light, machine and electricity;
2. 1064nm fiber laser is used as the laser source;
3. The fiber laser has a very high degree of integration, the optical path is fully enclosed, and no consumables, maintenance-free, long life, good optical quality (㎡ <1.3) and high reliability;
4. Small size, fast processing speed and low power consumption;
5. Novel appearance, reasonable structure, easy to operate, high precision and stable performance.

Specifications:
Specifications Description
Service Life ≥ 100,000 hours
Energy Consumption ≤ 1000W
Electro-Optical Conversion Efficiency ≥ 35%
Laser Output Mode Fundamental mode
Power Stability ≤ 3%
Warranty Period ≥ 1 year
Equipment Size 1300mm * 760mm * 1350mm
Equipment Weight 600kg

For more details please contact us as below:
Wuhan YOHA Solar Technology Co., Ltd
Address: No.776 High Tech Avenue, East Lake New High-tech Development Zone, Wuhan City, Hubei, China
Tel: 0086-13959254228
Website：www.yohasolar.com
Email：johnyang@yohasolar.com